Semiconductor package and manufacturing method thereof

ABSTRACT

A semiconductor package including an insulating layer, a chip, a thermal interface material, a heat-dissipating cover and a re-distribution layer is provided. The insulating layer has an accommodating opening. The chip is disposed in the accommodating opening. The chip has an active surface, a back surface opposite to the active surface and a side surface connected to the active surface and the back surface. The thermal interface material is filled in the accommodating opening for at least encapsulating the side surface of the chip and exposing the active surface. The re-distribution layer and the heat-dissipating cover are disposed on two side of the insulating layer respectively. The heat-dissipating cover is thermally coupled to the chip through the thermal interface material. The re-distribution layer covers the active surface of the chip and the thermal interface material, and the re-distribution layer is electrically connected to the chip.

BACKGROUND

Field of the Invention

The invention relates to a package and a manufacturing method thereof,and more particularly to a semiconductor package and a manufacturingmethod thereof.

Description of Related Art

To satisfy the needs for electronic products to be slim and small,semiconductor packages serving as core elements of the electronicproducts also develop toward miniaturization. Recently in the industry,a miniature semiconductor package such as chip-size package (CSP) hasbeen developed, which is characterized in that a size of the CSP isapproximately a size of a chip thereof or slightly larger than the sizeof the chip thereof. On the other hand, in addition to the miniaturesize, the semiconductor packages also need to enhance integrity and anamount of input/output terminals (I/O) for electrical connection toexternal electronic devices such as a circuit board, so as to satisfythe needs for electronic products to have high performance and highprocessing speed. To be able to arrange more input/output terminals(I/O) on a limited area of an active surface of the chip, wafer-levelsemiconductor packages such as Wafer-Level Chip-Size Package (WLCSP) isemerged.

Current WLCSP is generally manufactured by first performing a moldingprocess so that a molding compound covers a backside of the chip and aside surface connected to the backside while exposing an active surfaceopposite to the backside. Then, a re-distribution layer is formed on themolding compound and the active surface of the chip, and theinput/output terminals (I/O) on the active surface of the chip areelectrically connected to the re-distribution layer. Generally speaking,the molding compound formed via the molding process is thicker, which isunfavorable to the miniaturization of the WLCSP. In addition, since themolding compound has a lower thermal conductivity coefficient andunfavorable heat-dissipating effects, heat generated by the chip ismostly transmitted outside via a re-distribution layer, which haslimited heat-dissipating area or heat-dissipating path. Therefore,heat-dissipating efficiency is unfavorable. Under the circumstance thatthe heat cannot be rapidly transmitted to the outside and is accumulatedinside the WLCSP, a warpage may easily occur in the WLCSP.

SUMMARY OF THE INVENTION

A semiconductor package is provided, which has preferableheat-dissipating efficiency.

A method for manufacturing a semiconductor package is provided, capableof manufacturing a semiconductor package having preferableheat-dissipating efficiency.

A semiconductor package is provided, including an insulating layer, achip, a thermal interface material, a heat-dissipating cover and are-distribution layer. The insulating layer has an accommodatingopening. The chip is disposed in the accommodating opening. The chip hasan active surface, a back surface opposite to the active surface and aside surface connected to the active surface and the back surface. Thethermal interface material is filled in the accommodating opening for atleast encapsulating the side surface of the chip and exposing the activesurface. The re-distribution layer and the heat-dissipating cover aredisposed on two sides of the insulating layer respectively, and theheat-dissipating cover is thermally coupled to the chip via the thermalinterface material. The re-distribution layer covers the active surfaceof the chip and the thermal interface material, and the re-distributionlayer is electrically connected to the chip.

In an embodiment of the invention, the thermal interface material coversthe back surface and the side surface of the chip.

In an embodiment of the invention, the heat-dissipating cover contactsthe insulating layer and the thermal interface material.

In an embodiment of the invention, the thermal interface materialexposes the back surface of the chip, and the heat-dissipating covercontacts the insulating layer, the thermal interface material and theback surface of the chip.

In an embodiment of the invention, the insulating layer has a firstsurface and a second surface opposite to the first surface. Theheat-dissipating cover is disposed on the first surface while there-distribution layer is disposed on the second surface, and the backsurface of the chip cuts with the first surface of the insulating layer.

In an embodiment of the invention, the re-distribution layer includes atleast one patterned conductive layer and at least one patterneddielectric layer that are stacked alternately.

In an embodiment of the invention, the semiconductor package furtherincludes a plurality of solder balls. The plurality of solder balls areelectrically connected to the chip via the re-distribution layer.

In an embodiment of the invention, the solder balls and the chips arelocated on two sides of the re-distribution layer respectively.

A method for manufacturing a semiconductor package is provided, whichincludes the following steps. A heat-dissipating cover is formed on acarrier. An insulating layer is formed on the heat-dissipating cover,and the insulating layer has at least one accommodating opening toexpose a portion of the heat-dissipating cover. A chip is disposed inthe accommodating opening, and a thermal interface material is filled inthe accommodating opening, so that the thermal interface material coversthe chip and exposes an active surface of the chip. A re-distributionlayer is formed on the insulating layer, the thermal interface materialand the active surface of the chip, wherein the re-distribution layer iselectrically connected to the chip.

In an embodiment of the invention, the method for manufacturing thesemiconductor package further includes forming a plurality of solderballs on the re-distribution layer, wherein the solder balls areelectrically connected to the chip via the re-distribution layer.

In an embodiment of the invention, the method for manufacturing thesemiconductor package further includes separating the heat-dissipatingcover from the carrier.

A method for manufacturing a semiconductor package is provided, whichincludes the following steps. A heat-dissipating material layer isformed on a carrier. An insulating material layer is formed on theheat-dissipating material layer. The insulating material layer has aplurality of accommodating openings to expose a portion of theheat-dissipating material layer. A plurality of chips are disposed inthe accommodating openings respectively, and a thermal interfacematerial is filled in the accommodating openings, so that the thermalinterface material covers the chips and exposes active surfaces of thechips. A re-distribution circuit structure is formed on the insulatingmaterial layer, the thermal interface material and the active surfacesof the chips, wherein the re-distribution circuit structure includes aplurality of re-distribution layers, and each of the re-distributionlayers is electrically connected to a corresponding chip respectively.

In an embodiment of the invention, the method for manufacturing thesemiconductor package further includes forming a plurality of groups ofsolder balls on the re-distribution layer, wherein each group of solderballs are electrically connected to the corresponding chip via one ofthe re-distribution layers.

In an embodiment of the invention, the method for manufacturing thesemiconductor package further includes separating the heat-dissipatingmaterial layer from the carrier.

In an embodiment of the invention, the method for manufacturing thesemiconductor package further includes cutting the heat-dissipatingmaterial layer, the insulating material layer and the re-distributioncircuit structure along a pre-determined cutting line to form aplurality of semiconductor packages.

Based on the above, the semiconductor package of the invention at leastcovers the side surface of the chip located within the accommodatingopening of the insulating layer via the thermal interface material andcontacts the thermal interface material via the heat-dissipating cover,so as to have preferable heat-dissipating efficiency. On the other hand,the method for manufacturing the semiconductor package is provided,capable of manufacturing the semiconductor package having preferableheat-dissipating efficiency.

To make the above features and advantages of the present invention morecomprehensible, several embodiments accompanied with drawings aredescribed in detail as follows.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide further understanding,and are incorporated in and constitute a part of this specification. Thedrawings illustrate exemplary embodiments and, together with thedescription, serve to explain the principles of the disclosure.

FIGS. 1A to 1G illustrate a manufacturing process of a semiconductorpackage according to an embodiment of the invention.

FIG. 2 is a schematic view of a semiconductor package according toanother embodiment of the invention.

DESCRIPTION OF EMBODIMENTS

FIGS. 1A to 1G illustrate a manufacturing process of a semiconductorpackage according to an embodiment of the invention. Referring to FIG.1A, a carrier 10 is provided first, and a heat-dissipating materiallayer 110 is formed on the carrier 10. For instance, the carrier 10 maybe a sheet formed by a rigid material or a flexible material, or arelease film such as a thermal release film, a UV release film or otheradequate films), but the invention does not limit on the material of thecarrier 10. Herein, the heat-dissipating material layer 110 is, forexample, temporarily secured on the carrier 10 by means of adhesion, soas to facilitate subsequent processes. In this embodiment, theheat-dissipating material layer 110 may be formed by aluminum,magnesium, copper, silver, gold or other metal or metal alloys havinggood thermal conductivity, or formed by graphite or other non-metalmaterials having good thermal conductivity.

Then, referring to FIG. 1B, an insulating material layer 120 is formedon the heat-dissipating material layer 110, wherein a material of theinsulating material layer 120 may be polyimide, epoxy, Si, SiO_(x) orother adequate insulating materials. Herein, the insulating materiallayer 120 may have a plurality of accommodating openings 121 to expose aportion of the heat-dissipating material layer 110. For instance, themanufacturing of the insulating material layer 120 may be performed byfirst forming a layer of the insulating material all over theheat-dissipating material layer 110, and then forming the accommodatingopenings 121 on a specific area of the insulating material via processessuch as exposure and development or laser opening, so as to obtain anpatterned insulating material layer 120. Alternatively, the insulatingmaterial layer 120 having accommodating openings 121 may be formeddirectly on the heat-dissipating material layer 110 by means of ink-jetprinting, screen printing, curtain printing, spray coating printing ordry film adhesion, etc. However, the invention does not pose any limiton the manufacturing method for forming the insulating material layer120.

Next, referring to FIG. 1C, a plurality of chips 130 are disposed in theaccommodating openings 121 respectively, and a thermal interfacematerial 140 is filled in the accommodating openings 121, wherein thethermal interface material 140 may be a thermal glue, a thermal grease,a thermal film or a thermal tape. It should be noted that the inventiondoes not limit on the order of placing the chips 130 in theaccommodating openings 121 and filling the thermal interface material140 in the accommodating openings 121, so as to be applicable tomanufacturing processes for the thermal interface material 140 to coverat least a side surface 133 of the chips 130 and expose active surfaces131 of the chips 130.

In this embodiment, for example, the thermal interface material 140 isfilled in the accommodating openings 121 first, and then the chips 130are placed in the accommodating openings 121 having the thermalinterface material 140 while back surfaces 132 opposite to the activesurfaces 131 of the chips 130 keep distances D from the heat-dissipatingmaterial layer 110 (that is, the back surfaces 132 of the chips 130 donot contact the heat-dissipating material layers 110). In anotherembodiment, for example, the chips 130 are placed in the accommodatingopenings 121 first, so that the back surfaces 132 of the chips 130contact the heat-dissipating material layer 110. Then, the thermalinterface material 140 is filled in the accommodating openings 121 alonga gap between the side surfaces 133 of the chips 130 and inner walls ofthe accommodating openings 121. In yet another embodiment, for example,the chips 130 are placed in the accommodating openings 121 first, sothat the back surfaces 132 of the chips 130 contact the heat-dissipatingmaterial layer 110. Then, a thermal tape or a thermal film is pressedinto the accommodating openings 121 by means of vacuum lamination. Whenneeded, a portion of the thermal tape or the thermal film covering theactive surfaces 131 of the chips 130 may be removed to expose the activesurface 131.

Next, referring to FIG. 1D, a re-distribution circuit structure 150 isformed on the insulating material layer 120, the thermal interfacematerial 140 and the active surface 131 of each chip 130 viare-distribution process, wherein the re-distribution circuit structure150 includes a plurality of re-distribution layers 151, and each of there-distribution layers 151 is electrically connected to thecorresponding chip 130 respectively. More specifically, each of there-distribution layers 151 includes patterned conductive layers 151 aand 151 b and an patterned dielectric layer 151 c that are stackedalternately, wherein each of the re-distribution layers 151 connects tothe active surface 131 of the corresponding chip 130 via the patternedconductive layer 151 a, and a portion of the patterned conductivepattern 151 a contacts the thermal interface material 140. On the otherhand, the patterned dielectric layer 151 c exposes the patterneddielectric conductive layer 151 b. It should be noted that there-distribution layers are, for example, multi-layer circuit structures,and the number of circuit layers may vary according to actual needs.

Then, referring to FIG. 1E, balling and reflowing processes areperformed to form a plurality of groups of solder balls B on there-distribution layers 151, wherein each of the groups of solder balls Bis connected to the corresponding patterned conductive layer 151 b inthe re-distribution layers 151 respectively, so as to be electricallyconnected to the corresponding chip 130. In general, a material of thesolder balls B may include Tin, a Tin-Lead alloy or a Lead-free solder.Next, referring to FIG. 1F, the carrier 10 is removed from theheat-dissipating material layer 110, that is, the heat-dissipatingmaterial layer 110 and the carrier 10 are separated.

Finally, referring to both FIGS. 1F and 1G, a singulation process isperformed along a pre-determined cutting line L between any two adjacentchips 130, so as to form a plurality of semiconductor packages 100. Forinstance, a cutting tool or a laser cuts along the pre-determinedcutting line L that passes through the heat-dissipating material layer110, the insulating material layer 120 and the patterned dielectriclayer 151 c of the re-distribution circuit structure 150, and theprimary principle is to avoid harming the solder balls B. Now, themanufacturing of the semiconductor package 100 has been substantiallycompleted, wherein the cut heat-dissipating material layer 110 forms aheat-dissipating cover 110 a of the semiconductor package 100, and thecut insulating material layer 120 forms an insulating layer 120 a of thesemiconductor package 100.

During the manufacturing process of the semiconductor package 100, thepatterned insulating material layer 120 (i.e. the insulating materiallayer 120 having the plurality of accommodating openings 121) is used tosubstitute for a frame used in conventional press molding processes.Therefore, part of the manufacturing processes and required assistivedevice in conventional semiconductor packaging are dispensed, whichthereby helps reduce a package thickness of the semiconductor package100 and a cost for manufacturing the same.

Referring to FIG. 1G, in this embodiment, the semiconductor package 100includes the heat-dissipating cover 110 a, the insulating layer 120 a,the chip 130, the thermal interface material 140 and the re-distributionlayer 151. The chip 130 is disposed within the accommodating opening 121of the insulating layer 120 a. The thermal interface material 140 isfilled in the accommodating opening 121 for encapsulating the sidesurface 133 and the back surface 132 of the chip 130 and exposing theactive surface 131. The re-distribution layer 151 and theheat-dissipating cover 110 a are disposed on two opposite sides of theinsulating layer 120 a respectively. Since the heat-dissipating cover110 a contacts the insulating layer 120 a and the thermal interfacematerial 140 without directly contacting the back surface 132 of thechip 130, the heat-dissipating cover 110 a in this embodiment is, forexample, thermally coupled to the chip 130 via the thermal interfacematerial 140.

On the other hand, the re-distribution layer 151 covers the activesurface 131 and the thermal interface material 140 of the chip 130,wherein the re-distribution layer 151 is, for example, connected to theactive surface 131 of the chip 130 via the patterned conductive layer151 a to be electrically connected to the chip 130, and a portion of thepatterned conductive layer 151 a contacts the thermal interface material140. The solder balls B are respectively connected to the patternedconductive layers 151 b of the re-distribution layer 151, so as to beelectrically connected to the chip 130. Herein, the solder balls B andthe chip 130 are disposed respectively on two opposite sides of there-distribution layer 151.

In this embodiment, the back surface 132 and the side surface 133 of thechip 130 are covered by the thermal interface material 140, andtherefore the heat-dissipating area of the chip 130 is enhanced.Furthermore, the heat-dissipating cover 110 a is thermally coupled tothe chip 130 via the thermal interface material 140, and therefore heatgenerated during operation of the chip 130 is transmitted to the outsiderapidly via the thermal interface material 150 and the heat-dissipatingcover 110 a. In addition, since the portion of the patterned conductivelayer 151 a contacts the thermal interface material 140, heat generatedin the re-distribution layer 151 is also transmitted to the outsiderapidly via the thermal interface material 140 and the heat-dissipatingcover 110 a or be transmitted to the outside via the solder balls B.Accordingly, a warpage does not easily occur in the semiconductorpackage 100 due to the heat accumulated therein.

Other embodiments are provided below for further illustration. It shouldbe noted herein that the reference numerals and part of the contents inthe previous embodiment are used in the following embodiments, in whichidentical reference numerals indicate identical or similar components,and repeated description of the same technical contents is omitted. Fordetailed description of the omitted parts, reference can be found in theprevious embodiment, and no description will be repeated in thefollowing embodiments.

FIG. 2 is a schematic view of a semiconductor package according toanother embodiment of the invention. Referring to FIG. 2, thesemiconductor package 100A in this embodiment is substantially similarto the semiconductor package 100 in the previous embodiment, and theprimary difference therebetween lies in: the thermal interface material140 in this embodiment exposes the back surface 132 of the chip 130, andthe heat-dissipating cover 110 a contacts the insulating layer 120 a,the thermal interface material 140 and the back surface 132 of the chip130. More particularly, the insulating layer 120 a has a first surface121 a and a second surface 122 a opposite to the first surface 121 a,and the heat-dissipating cover 110 a is disposed on the first surface121 a while the re-distribution layer 151 is disposed on the secondsurface 122 a. In addition, the back surface 132 of the chip 130, forexample, cuts with the first surface 121 a of the insulating layer 120a.

Based on the above, the semiconductor package of the invention at leastcovers the side surface of the chip within the accommodating opening ofthe insulating layer via the thermal interface material and contacts thethermal interface material via the heat-dissipating cover, so that theheat-dissipating cover is thermally coupled to the chip via the thermalinterface material. Thereby, the heat generated during operation of thechip is transmitted to the outside rapidly via the thermal interfacematerial and the heat-dissipating cover. In addition, since a portion ofthe patterned conductive layer contacts the thermal interface material,heat generated in the re-distribution layer is also transmitted to theoutside rapidly via the thermal interface material and theheat-dissipating cover or be transmitted to the outside via the solderballs. Accordingly, the semiconductor package of the invention haspreferable heat-dissipating efficiency, and the warpage does not easilyoccur due to the heat.

On the other hand, the method for manufacturing the semiconductorpackage introduced herein not only manufactures the semiconductorpackage having preferable heat-dissipating efficiency but is also ableto use the patterned insulating material layer (i.e. the insulatingmaterial layer having the plurality of accommodating openings) tosubstitute for the frame used in conventional press molding processes.Therefore, part of the manufacturing processes and the required aids inconventional semiconductor packaging are dispensed, which thereby helpsreduce the package thickness of the semiconductor package and the costfor manufacturing the same.

Although the invention has been described with reference to the aboveembodiments, it will be apparent to one of ordinary skill in the artthat modifications to the described embodiments may be made withoutdeparting from the spirit of the invention. Accordingly, the scope ofthe invention will be defined by the attached claims and not by theabove detailed descriptions.

What is claimed is:
 1. A method for manufacturing a semiconductorpackage, comprising: forming a heat-dissipating material layer on acarrier; forming an insulating material layer on the heat-dissipatingmaterial layer, the insulating material layer having a plurality ofaccommodating openings to expose a portion of the heat-dissipatingmaterial layer; disposing a plurality of chips in the accommodatingopenings respectively and filling a thermal interface material in theaccommodating openings, so that the thermal interface material coversthe chips and exposes active surfaces of the chips, wherein theinsulating material layer, the thermal interface material, and theactive surfaces of the chips are coplanar to each other; and forming are-distribution circuit structure directly on the insulating materiallayer, the thermal interface material and the active surfaces of thechips, wherein the re-distribution circuit structure comprises aplurality of re-distribution layers, and each of the re-distributionlayers is electrically connected to a corresponding chip respectively.2. The method for manufacturing the semiconductor package according toclaim 1, further comprising: forming a plurality of groups of solderballs on the re-distribution layers, wherein each group of solder ballsis electrically connected to a corresponding chip respectively via oneof the re-distribution layers.
 3. The method for manufacturing thesemiconductor package according to claim 2, further comprising:separating the heat-dissipating material layer from the carrier.
 4. Themethod for manufacturing the semiconductor package according to claim 1,further comprising: cutting the heat-dissipating material layer, theinsulating material layer and the re-distribution circuit structurealong a per-determined cutting line to form a plurality of semiconductorpackages.
 5. A method for manufacturing a semiconductor package, thesemiconductor packaging comprising a heat dissipating cover, aninsulating layer disposed on the heat dissipating cover, a chip disposedon an accommodating opening of the insulating layer, a thermal interfacematerial disposed on the accommodating opening of the insulating layerand a re-distribution layer disposed on the chip, the insulating layer,and the thermal interface material, the method comprising: forming theheat-dissipating cover on a carrier; forming the insulating layer havingthe accommodating opening on the heat-dissipating cover, theaccommodating opening exposing a portion of the heat-dissipating cover;filling the accommodating opening with the thermal interface material;disposing the chip in the accommodating opening, wherein at least oneside surface of the chip is covered by the thermal interface material,wherein the insulating layer, the thermal interface material, and anactive surface of the chip are coplanar to each other; forming there-distribution layer directly on the insulating layer, the thermalinterface material and the active surface of the chip; and separatingthe heat-dissipating cover and the carrier.
 6. The method formanufacturing the semiconductor package according to claim 5, furthercomprising: forming a plurality of solder balls on the re-distributionlayer.
 7. The method for manufacturing the semiconductor packageaccording to claim 6, wherein the plurality of solder balls iselectrically connected to the chip through the re-distribution layer. 8.The method for manufacturing the semiconductor package according toclaim 5, wherein disposing the chip in the accommodating opening isdisposing the chip in the accommodating opening to have a back surfaceof the chip covered by the thermal interface material.
 9. The method formanufacturing the semiconductor package according to claim 5, whereindisposing the chip in the accommodating opening is disposing the chip inthe accommodating opening to have a back surface of the chip covered byat least one part of the heat-dissipating cover.
 10. The method formanufacturing the semiconductor package according to claim 5, whereinforming the insulating layer having the accommodating opening on theheat-dissipating cover is forming the insulating layer having theaccommodating opening on the heat-dissipating cover using ink-jetprinting, screen printing, curtain printing, spray coating printing ordry film adhesion.
 11. The method for manufacturing the semiconductorpackage according to claim 5, wherein directly forming there-distribution layer on the insulating layer, the thermal interfacematerial and the active surface of the chip is forming a patterneddielectric layer and a patterned conductive layer on the insulatinglayer, wherein the patterned conductive layer is electrically connectedto the chip.
 12. The method for manufacturing the semiconductor packageaccording to claim 5, wherein the insulating layer is formed to have afirst surface and a second surface opposite to the first surface, thefirst surface adhering to the heat-dissipating cover, the second surfaceof the insulating layer and the active surface of the chip are formed tobe coplanar and adhering to the re-distribution layer.
 13. The methodfor manufacturing the semiconductor package according to claim 5,wherein a plurality of semiconductor packages are formed simultaneouslyto each other and separated by cutting the heat-dissipating materiallayer formed by a plurality of heat dissipating covers, the insulatingmaterial layer formed by a plurality of insulating layers, and there-distribution circuit structure formed by a plurality ofre-distribution layers along a per-determined cutting line.
 14. Themethod for manufacturing the semiconductor package according to claim 5,wherein the thermal interface material is filled into the accommodatingopening along an inner wall of the accommodating opening, and the atleast one side surface of the chip is perpendicular to an interfacebetween the heat-dissipating cover and the thermal interface material.15. The method for manufacturing the semiconductor package according toclaim 14, wherein the step of filling the accommodating opening isperformed after the step of forming the insulating layer.